Plasma Enhanced Chemical Vapour Deposition (PECVD) 2

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The procurement includes delivery, installation and commissioning of one Plasma Enhanced Chemical Vapour Deposition System. The system will be used by a large number of operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The system is intended for deposition of thin layers of silicon dioxide (SiO2) and as close to “stoichiometric” silicon nitride (Si3N4) as possible.