8" Semi-Automatic Waffer Dicing Saw

Information

Offentligt udbud
30-08-2025 02:09 (GMT+02:00)
29-08-2025 07:00 (GMT+02:00)

Indkøber

VTT Technical Research Centre of Finland Ltd VTT Technical Research Centre of Finland Ltd
P.O. Box 1000, VTT
02044 Espoo
Finland
www.vtt.fi

Tidsfristen er overskredet

Kort beskrivelse

The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates.

The object of the tender process is described in more detail in the invitation to tender documents.
The object of the tender process is described in more detail in the invitation to tender documents.

Filer

Navn Størrelse
Annex 7 Supplier_CoC_EN.pdf 167 KB
Annex 2 Application examples with responses_RevB.pdf 187 KB
Annex 4 Experience - company references.docx 90 KB
TarjouspyyntoRaportti568546.pdf 980 KB
Annex 6 JYSE-terms SUPPLY April 2022.pdf 204 KB
Annex 5 Equipment purchase agreement_ DRAFT.pdf 204 KB
Annex 1 Specification for Dicing saw.pdf 55 KB
Annex 3 Acceptance test.pdf 183 KB
TarjouspyyntoRaportti568546.pdf 1000 KB
Annex 5 Equipment purchase agreement_ DRAFT.pdf 205 KB

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