8" Semi-Automatic Waffer Dicing Saw

Information

Procedure

Open procedure

Publication date

30.08.2025 02:09 (GMT+02:00)

Closing date

29.08.2025 07:00 (GMT+02:00)

Buyer

Name

VTT Technical Research Centre of Finland Ltd

Department

Contact

Address

P.O. Box 1000, VTT
02044 Espoo
Finland

Website

www.vtt.fi

Closing date has passed.

Short description

The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates.

The object of the tender process is described in more detail in the invitation to tender documents.
The object of the tender process is described in more detail in the invitation to tender documents.

Files (click "Show interest" to get access)

Name	Size
Annex 7 Supplier_CoC_EN.pdf	167 KB
Annex 2 Application examples with responses_RevB.pdf	187 KB
Annex 4 Experience - company references.docx	90 KB
TarjouspyyntoRaportti568546.pdf	980 KB
Annex 6 JYSE-terms SUPPLY April 2022.pdf	204 KB
Annex 5 Equipment purchase agreement_ DRAFT.pdf	204 KB
Annex 1 Specification for Dicing saw.pdf	55 KB
Annex 3 Acceptance test.pdf	183 KB
TarjouspyyntoRaportti568546.pdf	1000 KB
Annex 5 Equipment purchase agreement_ DRAFT.pdf	205 KB

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