8" Semi-Automatic Waffer Dicing Saw

Информация о тендерe

Procedure

Open procedure

Дата оглашения

30.08.2025 2:09 (GMT+02:00)

Срок подачи предложений

29.08.2025 7:00 (GMT+02:00)

Информация о покупателе

Название компании

VTT Technical Research Centre of Finland Ltd

Департамент

Контактное лицо

Aдрес

P.O. Box 1000, VTT
02044 Espoo
Финляндия

Веб-сайт

www.vtt.fi

Closing date has passed.

Информация о тендере

The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates.

The object of the tender process is described in more detail in the invitation to tender documents.
The object of the tender process is described in more detail in the invitation to tender documents.

Закупочная документация

Название	Объем
Annex 7 Supplier_CoC_EN.pdf	167 KB
Annex 2 Application examples with responses_RevB.pdf	187 KB
Annex 4 Experience - company references.docx	90 KB
TarjouspyyntoRaportti568546.pdf	980 KB
Annex 6 JYSE-terms SUPPLY April 2022.pdf	204 KB
Annex 5 Equipment purchase agreement_ DRAFT.pdf	204 KB
Annex 1 Specification for Dicing saw.pdf	55 KB
Annex 3 Acceptance test.pdf	183 KB
TarjouspyyntoRaportti568546.pdf	1000 KB
Annex 5 Equipment purchase agreement_ DRAFT.pdf	205 KB

Mercell Holding AS

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