Wafer Bonder-Aligner

Информация о тендерe

Open procedure
20.01.2026 14:11 (GMT+01:00)
27.11.2025 23:59 (GMT+01:00)

Информация о покупателе

Kungliga Tekniska Högskolan Kungliga Tekniska Högskolan
Malahat Mousavi
Brinellvägen 8
10044 Stockholm
Швеция
202100-3054
www.kth.se

Closing date has passed.

Информация о тендере

KTH need this system for Aligned semiconductor wafer bonding, which is a manufacturing process that is critical for future nanoelectronics, photonics, microwave systems, sensors, microelectromechanical systems (MEMS), and quantum systems.

Закупочная документация

Название Объем
InitialDocuments_9966581.zip 2,00 MB
Appendix 3 ESPD.pdf 453 KB
Appendix 2 Exclusion of suppliers- swedish-public-procurement-act 2016-1145.pdf 252 KB
Appendix 1. commersial confidentiality.xlsx 12 KB
Questions and answers.pdf 35 KB
INVITATION TO TENDER.pdf 210 KB
ADMINISTRATIVE RULES.pdf 238 KB
REQUIREMENTS REGARDING THE TENDERER.pdf 248 KB
EVALUATION OF TENDERS.pdf 195 KB
TECHNICAL SPECIFICATION .pdf 239 KB
COMMERCIAL TERMS (draft).pdf 267 KB
Wafer...-Report of the procurement result and award decision-2 - signed.pdf 233 KB

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