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Instrument for adhesion related problem solving in adhesively bonded wood systems (Automated Bonding Evaluation System)
Information
Notice type
 
Tender type
Procedure
Open procedure
Estimated tendering starting date
Estimated tendering closing date
Publication date
05.02.2020 10:17 (GMT+01:00)
Closing date
25.02.2020 11:00 (GMT+01:00)
Questions closing date
Recommended document due date
Accepts parallel bids
No
Accepts variant bids
No
Buyer
Name
South-Eastern Finland University of Applied Sciences
South-Eastern Finland University of Applied Sciences
Department
Contact
Nuutti Teräsalmi
Nuutti Teräsalmi
Address
Patteristonkatu 3 D
50100
Mikkeli
Finland
Org. number
2472908-2
Website
www.xamk.fi
Closing date has passed.
Short description
South-Eastern Finland University of Applied Sciences (Xamk) is purchasing a small innovative research and development instrument for adhesion related problem solving and innovation in adhesively bonded wood systems. The instrument will be located in Savonlinna.
The target of the purchase is to obtain a small-scale desktop instrument, which should be able to explore the dynamics of adhesion and development of bond strength characteristics under a wide range of highly controlled thermal, stress and chemical conditions for a diversity of adhesive and substrate types and applications. A key function is the provision of data on the effect of temperature on the rate of bond strength development for precisely formed miniature test bonds (bond area up to 25 x 25 mm) and to conduct testing according to the standard method described in ASTM D7998-15.
The budget for the ABES instrument is EUR 71000 (0% VAT). Tenders exceeding this will not be accepted by the Customer.
The subject of the procurement is described in Appendix 1 "Description of instrument".
Files (click "Show interest" to get access)
Name
Size
Tarjouspyyntö.pdf
113 KB
281600_liitteet.zip
188 KB
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