Instrument for adhesion related problem solving in adhesively bonded wood systems (Automated Bonding Evaluation System)

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South-Eastern Finland University of Applied Sciences (Xamk) is purchasing a small innovative research and development instrument for adhesion related problem solving and innovation in adhesively bonded wood systems. The instrument will be located in Savonlinna.

The target of the purchase is to obtain a small-scale desktop instrument, which should be able to explore the dynamics of adhesion and development of bond strength characteristics under a wide range of highly controlled thermal, stress and chemical conditions for a diversity of adhesive and substrate types and applications. A key function is the provision of data on the effect of temperature on the rate of bond strength development for precisely formed miniature test bonds (bond area up to 25 x 25 mm) and to conduct testing according to the standard method described in ASTM D7998-15.

The budget for the ABES instrument is EUR 71000 (0% VAT). Tenders exceeding this will not be accepted by the Customer.


The subject of the procurement is described in Appendix 1 "Description of instrument".