Piedāvājumu iesniegšanas termiņš ir beidzies.
The object of the procurement is silicon wafer laser marking tool. The silicon wafer laser marking tool (later “wafer marker” or “equipment”) will be installed in the Micronova facility in Espoo. The procurement and the technical specification of the equipment are described in detail in the invitation to tender documents.
Piesakieties Mercell un saņemiet paziņojumus par jaunākajiem iepirkumiem sev svarīgajās nozarēs 7 dienas bez maksas!