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The object of the procurement is plasma etcher. Plasma etcher can be used for cleaning and activation of different material surfaces (glass, plastic, elastomers etc.) by plasma. Process gases are ionized through microwave excitation in a vacuum chamber under low pressure of 0.1 - 1.5 mbar; chemical radicals generated in this low-pressure plasma are reacting with the product. The objective is for the equipment to be supplied by the 13th of December 2019 (13.12.2019) at the latest. The technical specification of the equipment to be supplied is discussed in more detail in invitation to tender documents and in Annex 1 “Minimum technical specifications of the plasma etcher”.