Single-sided Processing of 150 mm Silicon Wafers

Tildelingsinformationer

Single-sided processing of 150 mm silicon wafers (24 pcs) using SINTEF's in-house ‘Deep Reactive Ion Etch (DRIE)’ fabrication technology. Total budget: NOK 2.5 million (base) + NOK 7.5 million (options). Time frame: starting 2020Q3, 48 weeks (base). Options up to three subsequent runs of 24 wafers each, 48 weeks production time.