Automatic bonder

Information

Procedure

Open procedure

Publication date

3/18/2024 10:43 AM (GMT+01:00)

Closing date

4/2/2024 11:00 AM (GMT+02:00)

Buyer

Name

University of Helsinki

Department

Contact

Address

Yliopistonkatu 3
00100 Helsinki
Finland

Org. number

0313471-7

Website

www.helsinki.fi

Closing date has passed.

Short description

An automatic bonder (fine pitch wedge to wedge wire bonding and Single point Tape Automated Bonding (Sp-TAB)) will be acquired for the joint Detector laboratory of the Helsinki Institute of Physics and the University of Helsinki.

Files (click "Show interest" to get access)

Name	Size
Automatic bonder.pdf	417 KB
Automatic bonder.zip	2.50 MB

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