Defect, CD and overlay inspection tool

Hanke lühikirjeldus

Purpose of procurement KTH is seeking tenders for Defect, CD and overlay inspection tool The purpose of the procurement is to acquire a semi-automatic equipment based on optical microscopy for measurements of critical dimensions and overlay on patterned wafers as well as well as automatic scanning of wafers (patterned and non-patterned) for defect detection and classification. The tool will be placed in the Electrum Laboratory clean room in a multi-user environment with research and fabrication. It is important that the tool is user friendly and flexible.