Eesmärk
KTH and Albanova Nanolab intends to purchase a new RIE/ICP system (equipped with load-lock and cryo-stage) dedicated to fluorine based processing. The main use of the tool will be to reactively etch dielectrics, metals, and various superconductors, as well as low pressure argon milling of inert materials. The system should be able to perform high-quality anisotropic, deep silicon etching.