Eesmärk
KTH is seeking tenders for a vapour hydrofluoric acid etcher. The principal application of the instrument is to employ anhydrous hydrofluoric acid (aHF) for etching sacrificial silicon dioxide (SiO₂) with very high selectivity, and without stiction in the release etch of microelectromechanical (MEMS) devices made in silicon (Si), poly-Si, and aluminium (Al) structural materials.