Vapour Hydrofluoric Acid (HF) Etcher

Hanke lühikirjeldus

KTH is seeking tenders for a Vapour hydrofluoric acid etcher. The principal application of the instrument is to employ anhydrous hydrofluoric acid (aHF) for etching sacrificial silicon dioxide (SiO₂) with very high selectivity, and without stiction in the release etch of microelectromechanical (MEMS) devices made in silicon (Si), poly-Si, and aluminium (Al) structural materials. Purpose of procurement KTH is seeking tenders for one etching instrument that uses anhydrous hydrofluoric acid (aHF) vapour to etch sacrificial silicon dioxide (SiO₂) in the release etch of microelectromechanical (MEMS) devices. The content of this invitation to tender is an upgrade of the KTH clean-room free-etching capabilities. The activities of the main users of this tool are primarily focusing on micro-fabrication of MEMS and photonics devices.