Assignment text
The object of the tender process was automatic UV-laser system for electronic manufacturing of Medical, Aerospace, Research etc. Applications (later also “Equipment”). Main functions are cutting, laser ablation and drilling organic and inorganic heat sensitive substrates (LTCC green sheets, Sintered Ceramics, Plastics: PI, PET, PC, TPU, Metal sheets and paper, with minimal heat affected zone. Material thickness from 25 µm up to 8 mm focus height. Laser ablation is used for QR code marking and metal layer ablation over substrates.