The object of this information request is Scanning Electron Microscopy (later ‘SEM’). VTT is preparing the procurement of a new SEM in VTT's microelectronics cleanroom located in Espoo Finland ((
https://www.vttmemsfab.fi).
The object of this information request is Scanning Electron Microscopy (later ‘SEM’). VTT is preparing the procurement of a new SEM in VTT's microelectronics cleanroom located in Espoo Finland ((
https://www.vttmemsfab.fi).
With this market survey, VTT is searching potential suppliers and equipment available to get additional information on suppliers capable of delivering the equipment described in this information request.
SEM and Energy-Dispersive X-ray Spectroscopy (later ‘EDX’) analysis are essential methods in both R&D and manufacturing quality control. Therefore, the SEM needs to be very flexible, fulfilling research requirements (small specimen, chips, and cross sections) combined with full 200-mm wafer quality control features.
Some key features:
• specimen size up to 200-mm wafer size:
— 200-mm load lock, large chamber, allowing full 200-mm wafer inspection at high tilt (up to 30 degrees),
— 200-mm eucentric stage, full wafer access (-100mm ≤ radius ≤ 100 mm at high tilt).
• electron beam:
— schottky field-emission emitter,
— up to 30 kV,
— high resolution at low and high current, continuous current setting,
— analytical and high-resolution column mode.
• detectors:
— in-lens (Secondary Electron) SE detector,
— 2
— in-lens Electron backscattered detector (EBSD),
— additional sequential EBSD for additional topographic contrast,
— optional: STEM detector with 2-axis tilt,
— detector for Energy-dispersive X-ray Spectroscopy (EDX) with high counting rate (large detector surface ≥ 60 mm
• extra features:
— cooling trap,
— active anti-vibration system, compensating low frequency noise,
— additional flanges for future upgrade possibilities.
With this information request, VTT inquires your opinion about the following:
— your capability to sell the equipment described above,
— description of the equipment,
— delivery time,
— pricing model.