Lyhyt kuvaus
Oslo University will purchase a user-friendly laser processing system for cutting, marking and laser thermal processing of solid-state samples, primarily semi-conductor materials. The laser processing system must be able to cut different materials in a reasonable time. Such materials include, but are not limited to, silicone (Si), sapphire (Al2O3), silicone carbide (SiC), gallium oxide (Ga2O3) and glass (SiO2). An air-cooled laser with a wavelength equivalent to a green laser (532 mm) or shorter.
A user-friendly laser processing system for cutting, marking and laser thermal processing of solid samples, predominantly semiconductor wafers.