Hybrid thin Film Deposition System

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Purpose of procurement KTH is seeking tenders for a new hybrid thin film deposition system to be used for micro- and nanostructure fabrication. The main application of the procured tool will be metallisation of microelectronic circuits and hardmasks for etching using photoresist-liftoff techniques, making temperature control vitally important to avoid resist burning. Substrates will be mainly individual chips (possibly up to 80 % of the usage) and wafers up to 4’’ diameter (remaining 20 %), but with other new purchases and our recent push towards 4’’ processing, this ratio may shift in the near future. As requested by our user base and as a new capability for our lab, the system must come equipped with an ion gun for sample cleaning prior to deposition and low-energy ion-bombardment during evaporation for modified film properties.