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The CMP is specialist equipment for use in semiconductor materials processing. Typically, it is a fully enclosed -Laboratory tool that is capable of chemical mechanical planarization to achieve extremely smooth surface finish.
Scope
Lund Nano Lab is planning to purchase a new Chemical Mechanical Planarization (CMP) tool. The tool will be used to polish/planarize different III-V materials on wafer substrates of different dimensions (i.e. 2’’, 3’’, 4’’ diameters) to a high level of precision and low surface roughness. The tool must have many adjustable process parameters such as carrier speed/direction, platen speed/direction, slurry feed rates and carrier load pressure. That being said, the CMP tool must be able to use programmable recipes for automatic processing. The CMP tool must also have safety interlocks to ensure operator safety.