Silicon wafer laser marking tool

Information

Open procedure
6/12/2019 12:56 PM (GMT+02:00)
6/27/2019 11:00 AM (GMT+02:00)

Buyer

Teknologian tutkimuskeskus VTT Oy Teknologian tutkimuskeskus VTT Oy
P.O. Box 1000
02044 VTT
Finland
2647375-4

Closing date has passed.

Short description

The object of the procurement is silicon wafer laser marking tool. The silicon wafer laser marking tool (later “wafer marker” or “equipment”) will be installed in the Micronova facility in Espoo. The procurement and the technical specification of the equipment are described in detail in the invitation to tender documents.

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242878_liitteet.zip 638 KB
Tarjouspyyntö.pdf 213 KB

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