Inductively Coupled Plasma Reactive Ion Etch Tool/ICP-RIE System


03 - Contract award notice
Open procedure
9/18/2020 9:36 AM (GMT+02:00)


University of Jyväskylä University of Jyväskylä
Seminaarinkatu 15, Jyväskylän yliopisto
40014 Jyväskylä

Assignment text

An inductively-coupled-plasma reactive-ion-etcher (ICP-RIE), capable of flexible etching of different materials. Whole system with all required components. Capable of handling wafers up to 200 mm in diameter. There must be a loadlock and (semi)automatic loading of single-wafers and small chips between loadlock and process chamber. The substrate electrode temperature should be controllable between at least -150 °C and 300 °C. Contracting authority (JYU) may suspend the procurement procedure if the tenders exceed the budget available for the procurement. Prior references of supplying comparable systems are required.

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